Huawei Informs Customers: Memory for Ascend 960DT Must Be Purchased Separately
The Information reports that Huawei has informed some customers that its next-generation flagship AI chip, the Ascend 960DT, will primarily use HBM from Samsung and SK Hynix. Huawei is asking customers to source the memory themselves due to insufficient HBM production capacity among Chinese manufacturers. These HBM chips are soldered onto low-performance processors, declared for customs under the processor's code, and shipped to Hong Kong. They are then brought into mainland China by…
Huawei Informs Customers: They Must Procure Memory for Ascend 960DT Themselves
The Information reports that Huawei has informed some customers that its next-generation flagship AI chip, the Ascend 960DT, will primarily use HBM from Samsung and SK Hynix. The company is asking customers to source the memory themselves, as Chinese manufacturers lack sufficient HBM production capacity.
These HBM chips are soldered onto processors with significantly lower performance and are declared for customs as processor-based products, shipped to Hong Kong. From there, they are carried into mainland China by individuals, where the HBM is then desoldered using heat. A chip broker in Shenzhen stated that the price of a single HBM3E chip has surged from a few hundred dollars a year ago to around $4,000.
The Next Web
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